Source Title: Munich Shanghai Electronic Production Equipment Exhibition nine forum themes, take you into the professional "wisdom" to make a grand event
As an important exhibition and exchange platform for the electronics manufacturing industry, Munich Shanghai Electronic Production Equipment Exhibition will be held at the Shanghai New International Expo Center (E1-E6&C3) on March 20-22, 2024. The exhibition site will attract more than 800 innovative enterprises in the electronics manufacturing industry to join, and the exhibition scale will reach nearly 70,000 square meters. The range of exhibits covers the entire electronic manufacturing industry chain, including electronic and chemical materials, dispensing and bonding technology, electronic assembly automation, test measurement and quality assurance, electronic manufacturing services, surface mount technology, wire harness processing and connector manufacturing, component manufacturing, motion control and drive technology, industrial sensors, robots and intelligent warehousing, etc. One-stop, complete and efficient grasp of the global cutting-edge technologies and products in the whole industrial chain of intelligent manufacturing and electronic innovation.
This year's Munich Shanghai Electronics Production Equipment Show will focus on four major industry themes to carry out a total of 9 concurrent forums, the themes are:
- "AI + big data" leads the development of modern smart factories, focusing on the new trend of flexible "wisdom"
- Under the "dual carbon" innovation blueprint, insight into the new trend of new energy automotive electronics manufacturing
- New energy vehicles +AIoT+5G leverages the Blue Ocean market and drives the new growth momentum of advanced packaging
- Innovation drives the industry and technology leads the future
Under the refinement and derivative of the four major themes, the forum focused on industrial robots, flexible manufacturing, energy storage and new energy, automotive wiring harness, intelligent cockpit, intelligent manufacturing, TGV advanced materials, packaging, adhesives, new energy vehicles and other hot topics to carry out more discussions and exchanges.
1. Focus on AI+ Robot Flexible Intelligent Manufacturing Summit Forum
The robot industry is one of the fastest growing emerging industries in the world and has become an important symbol to measure the level of modern science and technology and high-end manufacturing. As a subversive intelligent productivity tool, the emergence of ChatGPT, like lighting a light bulb, detonated a new wave of the artificial intelligence industry, and also opened the prelude to the "big model era" in all walks of life. Among them, in the industrial and manufacturing fields related to the national economy and people's livelihood, various AI large models bloom, bringing new opportunities to the entire industry.
With the theme of diversified new models and formats of "AI+ robot + intelligent manufacturing", the forum invited well-known experts, scholars, research institutes and enterprise representatives to share and exchange ideas from many aspects such as innovation and technology, industrial development, solutions, and win-win cooperation, so as to create new advantages in cooperation and development and seize the commanding heights of future industrial development. The organizer will give full play to the role of a bridge and a link, focus on the needs of enterprises, and as always build a platform for innovation cooperation, exchanges and resources for participating enterprises, promote the formation of a good industrial ecology of innovation, cooperation and win-win, and contribute to helping guide the industry to take the path of high-quality development.
Topic Areas:
> "Big model era" AI enables new changes in manufacturing
> "AI+ robot" era, intelligent manufacturing route and practice
> "AI+ robot" drives the power of industrial intelligent manufacturing innovation
> Robotized intelligent manufacturing has become the main direction of intelligent manufacturing
> Digital workshop robot system design and intelligent technology engineering practice
> Flexible manufacturing, intelligent industry break
> Flexible manufacturing brings new opportunities for overtaking
2, energy storage and new energy lithium battery technology conference
In the wave of global pursuit of sustainable development, new energy and energy storage technology as a key driving force in the field of clean energy has gradually attracted widespread attention. The continuous advancement of digital technology has brought new opportunities and challenges to the energy industry, while also spawning innovative development models. The forum will discuss the latest trends, innovative applications and sustainable development strategies in the field of new energy and storage.
The conference will bring together experts, academics, business representatives and technology innovators from various fields around the world to discuss the key role of new energy and storage technologies in sustainable energy systems. We will share the latest scientific research results, practical application cases and innovative solutions in the field of new energy and energy storage, aiming to promote cross-border exchanges and business cooperation and jointly promote sustainable development in the energy sector.
Topic Areas:
- Digital transformation of the battery industry
-3D vision guided automotive lead battery automation solution
- Network energy thinking on the informatization of energy enterprises
- Automation solutions for the lithium energy industry
- New energy lithium battery solution
- Application of robots in automated production lines of new energy vehicles
- Lithium equipment solution
3, New energy & Intelligent network vehicle wiring harness and connection technology forum
At present, vehicle electrification and intelligent technology is developing rapidly, and its large number of electronic components and super-capacity power batteries make vehicle design more and more complex. As one of the core components of automotive electrical system, automotive wiring harness and connection technology is facing great and profound changes. This change is not only reflected in extremely high transmission rates, wider compatibility and functional protocols, and more stringent electromagnetic interference (EMI) requirements, but also with the upgrade of automotive electrical/electronic (E/E) architecture, the structure, components and processes of all automotive communication cables are required to be comprehensively reviewed, and even specified or redesigned. In the face of the rapid development and change of the automobile industry, how to flexibly adjust the strategy and conform to the industry trend directly affects the survival and development of enterprises in the new cycle. This forum will discuss and analyze the technological development and general direction of industry demand of new energy & intelligent connected vehicle wiring harness and connection from the aspects of industrial development, technological innovation and solutions, and deeply explore innovative solutions by sharing practical experience.
Topic Areas:
- Design and requirements of wiring harnesses and connectors for new energy vehicle power systems
Automotive high voltage Automotive high voltage cable application and technology development trend
- Intelligent solutions for automotive high voltage wire harness processing
- Automotive intelligent electronic and electrical architecture and its impact on the new form of automotive wiring harness
- High-speed on-board Ethernet transmission solutions and development trends
- Application and technology development trend of automotive Ethernet high-speed transmission cable
- Intelligent solutions for automotive Ethernet wiring harness processing
4, Intelligent car cabin and automotive electronics manufacturing Summit Forum
With the evolution of automotive intelligence, Oems have redefined products, allowing users to have a new understanding of the car, and the future of the car has arrived. Intelligent cockpit is an important way to reflect the intelligence of automobiles in the face of consumers, and it is also the core carrier of space shaping through technology. Intelligent cockpit and automatic driving have also become standard on more and more models. At the same time, the vehicle intelligence is further upgraded and popularized, and at the same time, the demand for intelligent manufacturing is growing, but also put forward more technical challenges, such as automation and intelligence, data management and analysis, equipment interconnection and communication, multi-technology integration and so on.
In this context, the forum invited Oems, TIER1 and leading technology enterprises related to intelligent manufacturing to discuss new technologies of intelligent cockpit and automotive electronics and how to use intelligent manufacturing to improve production efficiency, reduce production costs, and improve product quality and reliability.
Topic Areas:
- Reflections on the development of the next generation of intelligent cabins
- dielectric-free holographic intelligent cockpit solution
- Equipment development opportunities brought about by intelligent cockpit display innovation
- Intelligent cockpit cross-domain integration
- User experience drives smart cockpit development
- Analysis of the trend of intelligent cockpit light display technology
- Application of AI technology in automotive electronic intelligent manufacturing
- Automotive electronic product design and manufacturing solutions
5, electronic intelligent manufacturing and Frontier Technology Summit Forum
In the process of promoting intelligent manufacturing in the production industry of electronic information products, the automation of the production of multi-variety and small-batch components, and then the implementation of intelligent production paths and successful cases, has very important significance and demonstration effect for many small and medium-sized enterprises. At the same time, the power limit order will once again put energy saving and consumption reduction in front of all enterprises; The Chinese government strives to achieve carbon peak before 2030 and achieve carbon neutrality before 2060, which will also force manufacturing enterprises to take cost-effective and low energy consumption into comprehensive consideration in the renovation of production equipment, which is both an opportunity and a challenge for manufacturing enterprises and suppliers!
The Electronics Manufacturing industry feast - 2024 Electronics Manufacturing Intelligence and Cutting-edge Technology Summit Forum held during productronica China is expected to attract participation from electronics manufacturing equipment manufacturers and electronics manufacturing end users.
Topic Areas:
- Communication standards and digital transformation of electronics manufacturing
- Development and challenges of assembly/packaging technology for RF applications
- Challenges posed by the development of SiP packaging to SMT production processes
- High-end inspection equipment (AOI/X-ray, etc.) helps zero defect production
- Design and implementation of flexible PCBA and assembly line automation solutions
Electronics manufacturing - from smart devices to digital factories
- Applications of efficient detection sensors in the electronics manufacturing industry
6, flexible and printed electronics industry foresight Summit Forum
Printed electronics technology is an electronic manufacturing technology based on the printing principle. The biggest characteristics and advantages of printed electronic products are large area, flexibility, low cost, in sharp contrast to silicon-based microelectronics, and the manufacturing method is low-temperature additive manufacturing, which has the characteristics of green environmental protection. The use of inkjet printing methods can also achieve digital and personalized manufacturing. Since printed electronics can print any material that can be inked and can be made on any substrate material, printed electronics can be widely used in wearable electronics and other aspects. In this forum, we will explore some of the leading technologies in the flexible and printed electronics industry.
Topic Areas:
- Printed electronics development trajectory and its future direction
- Flexible electronic high resolution inkjet printing technology and equipment
- Flexible semiconductors and radio frequency devices for printing processes
- Human-machine information interface based on flexible sensing
- Flexible paper batteries and their applications
- Packaging strategies for flexible electronic devices
7, TGV Advanced materials and packaging industrialization opportunity Summit Forum
As semiconductor circuits become more complex, plastic substrates will soon reach the limits of accommodation, and their rough surfaces, in particular, will negatively affect the inherent performance of hyperfine circuits, so the semiconductor industry needs a new type of substrate. Intel predicts that by the end of the 2020s (between 2020 and 2030), semiconductor processes may encounter the limit of the size of transistors on organic materials substrates, and face mechanical issues such as power consumption and substrate shrinkage and warping, so the switch to glass machine boards will become an important key factor in the next generation of semiconductor processes. Intel expects to launch a complete glass substrate solution in the second half of the 2020s and continue to advance Moore's Law after 2030.
This forum will discuss the application of glass-based chip board level seal loading board in Mini/Micro direct display, MIP package, 2.5D/3D package, RF chip carrier board, optical communication chip carrier board and other chip carrier board, especially in the field of semiconductor advanced packaging.
Topic Areas:
- Opportunities and challenges for TGV technology development under the Al+Chiplet trend
- Glass material manufacturers in the glass substrate application solutions
- Development of advanced packaging technology and its requirements for materials
8, 2024 High-end electronic adhesive Material hot Technology Innovation Seminar and 2024 Advanced Electronic dispensing and adhesive Technology Forum
In recent years, the rapid development of emerging industries such as 5G, artificial intelligence, smart phones, new energy vehicles, and the Internet of Things has stimulated the rapid development of China's high-end electronics and its adhesive industry. In 2022, the total consumption of electronic adhesives in China is about 12 billion yuan, of which high-end electronic adhesives such as semiconductors, new displays, automotive electronics, and intelligent driving account for more than 50 percent.
How to grasp this historical opportunity to adapt to the rapid development of high-end electronic adhesive industry with high requirements, high standards and high added value! In order to promote rubber enterprises to accurately pulse the latest development trends and opportunities of China's high-end electronic adhesive market and technology, and boost the rapid and high-quality development of China's high-end electronic adhesive industry, Munich Shanghai Electronic Production Equipment Exhibition will hold 2024 high-end electronic adhesive materials hot technology innovation Seminar and 2024 Advanced electronic dispensing and adhesive Technology Forum at the same time.
Topic Areas:
- Application of thermal conductive materials in automated battery assembly
- Electronic adhesive applications in semiconductor and high-end manufacturing
- The application of silicone adhesive in new energy
- Organic silicone solutions for automotive applications
9, New energy vehicle electronics and high reliability technology Forum
The prosperity of new energy vehicles has accelerated the revolution of automotive electronics, and high reliability requirements such as high voltage safety, temperature adaptability, shock and impact resistance, high reliability and durability are constantly iterating. While the safety and intelligence requirements of automobiles continue to increase, the high reliability of automotive electronics PCBA is undoubtedly the focus of attention. This forum will jointly explore the development of new energy vehicle electronics and high reliability technology, technology-based, the same frequency link, win-win cooperation.
Topic Areas:
- How to achieve the high reliability of PCBA for new energy vehicle electronics?
- Typical problems and solution cases of international industry standards and corporate practices for automotive electronics
- Best practices for automotive circuit boards and assembly suppliers
- Excellent solutions for testing and material and chemical suppliers, etc
Editor: Zhang Wei (QN0001)